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UCC3583NG4 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC3583NG4 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 18 page  2 UCC1583 UCC2583 UCC3583 ABSOLUTE MAXIMUM RATINGS VDD .......................................... 15V IVDD ......................................... 15mA RAMP ............................. –0.3V to VDD +1V IRAMP .........................................5mA IREF .................................................... –30mA PCOM .................................. –0.2V to 0.2V IGATE (twp < 1µS and Duty Cycle < 10%) ...... –0.8A to 1.8A ICOMP .................................. –5mA to 5mA ICAO ................................... –5mA to 5mA VSYNC ............................ –0.6V to VREF +0.3V ISYNC ................................. –05mA to 5mA INV, SS, ILIM, ISENSE.............. –0.3V to VREF + 0.3V Storage Temperature ................... –65°C to +150°C Junction Temperature ................... –55°C to +150°C Lead Temperature (Soldering, 10 sec.) ............. +300°C All voltages are with respect to the COM terminal unless other- wise stated. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. CONNECTION DIAGRAMS DIL-14, SOIC-14 (Top View) J, N, or D Packages ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA = –55°Cto125°C for UCC1583, –40°C to 85°C for UCC2583, and 0°C to 70°C for UCC3583; VDD = 12V, RT = 60k, CT = 100pF, TA =TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Ramp Generation and Synchronization Maximum Input Operating Frequency For input with 5% to 90% duty cycle (Note 1) 500 kHz Ramp Frequency, Free Running TA = 25°C 95 100 105 kHz TA = -55°C to 125°C 90 100 110 kHz Ramp Discharge Current VRAMP = 0.5V 2.0 3.6 mA Low Threshold Voltage No min, no max, 0=TYP 0 V High Threshold Voltage 3.75 4 4.25 V Synchronizing Threshold Voltage (On) (Note 1) 1 V Synchronizing Comparator Hysteresis 1 V PLCC-20 (Top View) Q Package PACKAGE qja qjc N-14 90 45 J-14 90-120 28 D-14 50-120 35 PLCC-20 43-75 34 Note 1. qja (junction to ambient) is for devices mounted to 5 in2 FR4 PC board with one ounce copper where noted. When re- sistance range is given, lower values are for 5 in2 aluminum PC board. Test PWB was .062 in thick and typically used 0.635 mm trace widths for power pkgs and 1.3 mm trace widths for non-power pkgs with a 100x100 mil probe land area at the end of each trace Note 2. qjc data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states that “The baseline values shown are worst case (mean + 2s) for a 60x60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14400 square mils. For device die sizes greater than14400 square mils use the following values; dual-in-line, 11°C/W; flat pack, 10°C/W; pin grid array, 10°C/W”. THERMAL IMPEDANCE |
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