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M393B1K70CH0 Datasheet(PDF) 3 Page - Samsung semiconductor

Part # M393B1K70CH0
Description  240pin Registered DIMM based on 2Gb C-die
Download  53 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

M393B1K70CH0 Datasheet(HTML) 3 Page - Samsung semiconductor

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DDR3 SDRAM
Rev. 1.0
Registered DIMM
Table Of Contents
240pin Registered DIMM based on 2Gb C-die
1. DDR3 Registered DIMM Ordering Information ............................................................................................................. 5
2. Key Features................................................................................................................................................................. 5
3. Address Configuration .................................................................................................................................................. 5
4. Registered DIMM Pin Configurations (Front side/Back side)........................................................................................ 6
5. Pin Description ............................................................................................................................................................. 7
6. ON DIMM Thermal Sensor ........................................................................................................................................... 7
7. Input/Output Functional Description.............................................................................................................................. 8
8. Pinout Comparison Based On Module Type................................................................................................................. 9
9. Registering Clock Driver Specification.......................................................................................................................... 10
9.1 Timing & Capacitance values .................................................................................................................................. 10
9.2 Clock driver Characteristics..................................................................................................................................... 10
10. Function Block Diagram:............................................................................................................................................. 11
10.1 2GB, 256Mx72 Module (Populated as 1 rank of x8 DDR3 SDRAMs) ................................................................... 11
10.2 4GB,512Mx72 Module (Populated as 2 ranks of x8 DDR3 SDRAMs) .................................................................. 12
10.3 4GB, 512Mx72 Module (Populated as 1 rank of x4 DDR3 SDRAMs) ................................................................... 13
10.4 8GB, 1Gx72 Module (Populated as 2 ranks of x4 DDR3 SDRAMs) ..................................................................... 14
10.5 8GB, 1Gx72 Module (Populated as 4 ranks of x8 DDR3 SDRAMs) .................................................................... 16
10.6 16GB, 2Gx72 Module (Populated as 4 ranks of x4 DDR3 SDRAMs) ................................................................... 17
11. Absolute Maximum Ratings ........................................................................................................................................ 22
11.1 Absolute Maximum DC Ratings............................................................................................................................. 22
11.2 DRAM Component Operating Temperature Range .............................................................................................. 22
12. AC & DC Operating Conditions................................................................................................................................... 22
12.1 Recommended DC Operating Conditions (SSTL-15)............................................................................................ 22
13. AC & DC Input Measurement Levels .......................................................................................................................... 23
13.1 AC & DC Logic Input Levels for Single-ended Signals.......................................................................................... 23
13.2 VREF Tolerances. ................................................................................................................................................. 24
13.3 AC and DC Logic Input Levels for Differential Signals .......................................................................................... 25
13.3.1. Differential Signals Definition ......................................................................................................................... 25
13.3.2. Differential Swing Requirement for Clock (CK - CK) and Strobe (DQS - DQS) ............................................. 25
13.3.3. Single-ended Requirements for Differential Signals ...................................................................................... 26
13.3.4. Differential Input Cross Point Voltage ............................................................................................................ 27
13.4 Slew Rate Definition for Single Ended Input Signals............................................................................................. 27
13.5 Slew rate definition for Differential Input Signals ................................................................................................... 27
14. AC & DC Output Measurement Levels ....................................................................................................................... 28
14.1 Single Ended AC and DC Output Levels............................................................................................................... 28
14.2 Differential AC and DC Output Levels ................................................................................................................... 28
14.3 Single-ended Output Slew Rate ............................................................................................................................ 28
14.4 Differential Output Slew Rate ................................................................................................................................ 29
15. DIMM IDD specification definition ............................................................................................................................... 30
16. IDD SPEC Table ......................................................................................................................................................... 32
17. Input/Output Capacitance ........................................................................................................................................... 35
18. Electrical Characteristics and AC timing ..................................................................................................................... 37
18.1 Refresh Parameters by Device Density................................................................................................................. 37
18.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 37
18.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin ................................................................. 37
18.3.1. Speed Bin Table Notes .................................................................................................................................. 40
19. Timing Parameters by Speed Grade .......................................................................................................................... 41
19.1 Jitter Notes ............................................................................................................................................................ 44
19.2 Timing Parameter Notes........................................................................................................................................ 45
20. Physical Dimensions................................................................................................................................................... 46
20.1 256Mbx8 based 256Mx72 Module (1 Rank) - M393B5773CH0............................................................................ 46
20.1.1. x72 DIMM, populated as one physical rank of x8 DDR3 SDRAMs46


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