53

Revised: June 3, 2012

POLY-FUSE

© 2012 Littelfuse, Inc

Surface Mount > 2920L Series

2920L Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/2920L.html for current information.

Environmental Specifications

Soldering Parameters

Condition

Reflow

Peak Temp/ Duration Time

260°C / 10 Sec

Time above liquids (TAL) 220°C

60 Sec ~ 100 Sec

Preheat 120°C~ 180°C

50 Sec ~ 150 Sec

Storage Condition

<

=70%RH

solvents.

Note:

devices may not meet the performance requirements.

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped

State

125°C

Passive Aging

-/+5% typical resistance change

Humidity Aging

-/+5% typical resistance change

Thermal Shock

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

Vibration

Moisture Sensitivity Level

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin(Sn))

Lead Solderability

Preheating

120

180

220

260

0

60 to 100

Soldering

Cooling

120

50 to 150

Time(s)