©2008 Littelfuse, Inc.

Revised: August 11, 2009

Gas Plasma Arrester (GDT) Products

AC and CG3 Series

Specifications are subject to change without notice.

Refer to www.littelfuse.com/series/AC.html or /CG3.html for current information.

AC and CG3 Series

Reflow Condition

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (Min to Max) (t

Average ramp up rate (LiquidusTemp

(T

3°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

Do not exceed

260°C

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Time

25

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

100

150

60-180 seconds

Solder PotTemperature:

280

°

Solder DwellTime:

2-5 seconds

Recommended Process Parameters: