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LM1117I Datasheet(PDF) 3 Page - Texas Instruments

Part # LM1117I
Description  800mA Low-Dropout Linear Regulator
Download  30 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM1117I Datasheet(HTML) 3 Page - Texas Instruments

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NOT CONNECTED
VOUT
VOUT
VOUT
1
2
3
4
8
7
6
5
ADJ/GND
VIN
VIN
VIN
VOUT
LM1117-N
www.ti.com
SNOS412L – MAY 2004 – REVISED JULY 2012
Figure 5. TO-263 Top View
Figure 6. Side View
When using the LLP package
Pins 2, 3 & 4 must be connected together and
Pins 5, 6 & 7 must be connected together
Figure 7. LLP Top View
ABSOLUTE MAXIMUM RATINGS
(1)
Maximum Input Voltage (VIN to GND)
20V
Power Dissipation(2)
Internally Limited
Junction Temperature (TJ)
(2)
150°C
Storage Temperature Range
-65°C to 150°C
Lead Temperature
TO-220 (T) Package
260°C, 10 sec
SOT-223 (IMP) Package
260°C, 4 sec
ESD Tolerance(3)
2000V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
(3)
For testing purposes, ESD was applied using human body model, 1.5k
Ω in series with 100pF.
OPERATING RATINGS
(1)
Input Voltage (VIN to GND)
15V
Junction Temperature Range (TJ)
(2)
LM1117
0°C to 125°C
LM1117I
−40°C to 125°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Copyright © 2004–2012, Texas Instruments Incorporated
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Product Folder Links: LM1117-N


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