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AD5341BRU Datasheet(PDF) 6 Page - Analog Devices |
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AD5341BRU Datasheet(HTML) 6 Page - Analog Devices |
6 / 28 page AD5330/AD5331/AD5340/AD5341 Rev. A | Page 6 of 28 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating VDD to GND −0.3 V to +7 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Output Voltage to GND −0.3 V to VDD + 0.3 V Reference Input Voltage to GND −0.3 V to VDD + 0.3 V VOUT to GND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP Package Power Dissipation (TJ max – TA)/θJA mW θJA Thermal Impedance (20-Lead TSSOP)1 85°C/W θJA Thermal Impedance (24-Lead TSSOP)1 80°C/W Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION 1 Thermal resistance (JEDEC 4-layer (2S2P) board). |
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