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MBRS1100T3G Datasheet(PDF) 1 Page - ON Semiconductor

Part # MBRS1100T3G
Description  Schottky Power Rectifier
Download  4 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MBRS1100T3G Datasheet(HTML) 1 Page - ON Semiconductor

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 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 10
1
Publication Order Number:
MBRS1100T3/D
MBRS1100T3G,
SBRS81100T3G,
MBRS190T3G,
SBRS8190T3G
Preferred Devices
Schottky Power Rectifier
Surface Mount Power Package
Schottky Power Rectifiers employ the use of the Schottky Barrier
principle in a large area metal-to-silicon power diode. State-of-the-art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for low voltage, high frequency
rectification, or as free wheeling and polarity protection diodes, in
surface mount applications where compact size and weight are critical
to the system. These state-of-the-art devices have the following
features:
Features
Small Compact Surface Mountable Package with J-Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
High Blocking Voltage − 100 Volts
175C Operating Junction Temperature
Guardring for Stress Protection
AEC−Q101 Qualified and PPAP Capable
SBRS8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Shipped in 12 mm Tape and Reel, 2,500 units per reel
Cathode Polarity Band
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SMB
CASE 403A
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
90, 100 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
MARKING DIAGRAM
http://onsemi.com
B1 = Device Code
x
= C for MBRS1100T3
9 for MBRS190T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
=Pb−Free Package
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
AYWW
B1xG
G
(Note: Microdot may be in either location)


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