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ADG918BRM-500RL7 Datasheet(PDF) 5 Page - Analog Devices |
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ADG918BRM-500RL7 Datasheet(HTML) 5 Page - Analog Devices |
5 / 16 page ADG918/ADG919 Rev. C | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 2. Parameter Rating VDD to GND –0.5 V to +4 V Inputs to GND –0.5 V to VDD + 0.3 V1 Continuous Current 30 mA Input Power 18 dBm Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C MSOP Package θJA Thermal Impedance 206°C/W LFCSP Package θJA Thermal Impedance (2-layer board) 84°C/W θJA Thermal Impedance (4-layer board) 48°C/W Lead Temperature, Soldering (10 sec) 300°C IR Reflow, Peak Temperature (<20 sec) 235°C ESD 1 kV 1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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