PACKAGE OPTION ADDENDUM

www.ti.com

5-Dec-2011

Addendum-Page 2

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

UC3901DTRG4

ACTIVE

SOIC

D

14

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

UC3901DW

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

UC3901DWG4

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

UC3901DWTR

ACTIVE

SOIC

DW

16

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

UC3901DWTRG4

ACTIVE

SOIC

DW

16

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

UC3901N

ACTIVE

PDIP

N

14

25

Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type

UC3901NG4

ACTIVE

PDIP

N

14

25

Green (RoHS

& no Sb/Br)

CU NIPDAU N / A for Pkg Type

UC3901Q

ACTIVE

PLCC

FN

20

46

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

UC3901QG3

ACTIVE

PLCC

FN

20

46

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

UC3901QTR

ACTIVE

PLCC

FN

20

1000

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

UC3901QTRG3

ACTIVE

PLCC

FN

20

1000

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.