UCC27511

UCC27512

www.ti.com

SLUSAW9D – FEBRUARY 2012 – REVISED MAY 2013

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Supply voltage range, VDD

4.5

12

18

V

Operating junction temperature range

-40

140

°C

Input voltage, IN+ and IN-

0

18

V

THERMAL INFORMATION

UCC27511

UCC27512

THERMAL METRIC

SOT-23 (DBV)

UNITS

6 PINS

6 PINS

217.8

85.6

97.6

100.1

72.2

58.6

°C/W

8.6

7.5

71.6

58.7

n/a

23.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

NOTE

Under identical power dissipation conditions, the DRS package will allow to maintain a

lower die temperature than the DBV.

dissipation

capability

between

different

packages

(Refer

to

the

APPLICATION

INFORMATION Section).

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