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UCC27211DPRR Datasheet(PDF) 2 Page - Texas Instruments |
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UCC27211DPRR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page PWM CONTROLLER +12V ISOLATION AND FEEDBACK +100V SECONDARY SIDE CIRCUIT HI DRIVE LO DRIVE HI V DD UCC27210 VSS LI HB HO HS LO PWM CONTROLLER +12V +100V SECONDARY SIDE CIRCUIT HI DRIVE LO DRIVE HI V DD UCC27211 VSS LI HB HO HS LO +12V HI DRIVE LO DRIVE HI VDD UCC27211 LI HB HO HS LO +100V UCC27210 UCC27211 SLUSAT7C – NOVEMBER 2011 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONT.) The UCC27210/1’s switching node (HS pin) is able to handle -18 V maximum which allows the high-side channel to be protected from inherent negative voltages caused parasitic inductance and stray capacitance. The UCC27210 (Pseudo-CMOS inputs) and UCC27211 (TTL inputs) have increased hysteresis allowing for interface to analog or digital PWM controllers with enhanced noise immunity. The low-side and high-side gate drivers are independently controlled and matched to 2 ns between the turn on and turn off of each other. An on-chip 120-V rated bootstrap diode eliminates the external discrete diodes. Under-voltage lockout is provided for both the high-side and the low-side drivers providing symmetric turn-on/turn-off behavior and forcing the outputs low if the drive voltage is below the specified threshold. Both devices are offered in 8-pin SOIC (D), PowerPAD™ SOIC-8 (DDA), 4-mm x 4-mm SON-8 (DRM) and SON- 10 (DPR) packages. Typical Application Diagrams ORDERING INFORMATION (1) PACKAGED DEVICES(1) INPUT TEMPERATURE RANGE TA = TJ PowerPAD™ COMPATIBILITY SOIC-8 (D)(2) SON-8 (DRM)(3) SON-10 (DPR)(4) SOIC-8 (DDA)(2) Pseudo CMOS UCC27210D UCC27210DDA UCC27210DRM UCC27210DPR -40°C to 140°C TTL UCC27211D UCC27211DDA UCC27211DRM UCC27211DPR (1) These products are packaged in Lead (Pb)-Free and green lead finish of PdNiAu which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations. (2) D (SOIC-8) and DDA (Power Pad™ SOIC-8) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27210ADR/UCC27211ADR) to order quantities of 2,500 devices per reel. (3) DRM (SON-8) package comes either in a small reel of 250 pieces as part number UCC27210ADRMT/UCC27211ADRMT, or larger reels of 3000 pieces as part number UCC27210ADRMR/UCC27211ADRMR. (4) DPR (SON-10) package comes either in a small reel of 250 pieces as part number UCC27210ADPRT/UCC27211ADPRT, or large reels of 3000 pieces as part number UCC27210ADPRR/UCC27211ADPRR. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): UCC27210 UCC27211 |
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