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UCC37322DRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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UCC37322DRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com DESCRIPTION (CONTINUED) Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages.With this drive architecture, UCC37321/2/3 can be used in industry standard 6-A, 9-A and many 12-A driver applications. Latch up and ESD protection circuitries are also included. Finally, the UCC37321/2 provides an enable (ENBL) function to have better control of the operation of the driver applications. ENBL is implemented on pin 3 which was previously left unused in the industry standard pin-out. It is internally pulled up to Vdd for active high logic and can be left open for standard operation. In addition to SOIC-8 (D) and PDIP-8 (P) package offerings, the UCC37321/2 also comes in the thermally enhanced but tiny 8-pin MSOP PowerPAD™ (DGN) package. The PowerPAD™ package drastically lowers the thermal resistance to extend the temperature operation range and improve the long-term reliability. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) UCCx732x UNIT Supply voltage, VDD -–0.3 to 16 V Output current (OUT) DC, IOUT_DC 0.6 A –0.3 V to 6 V or VDD+0.3 Input voltage (IN), VIN (whichever is larger) V –0.3 V to 6 V or VDD+0.3 Enable voltage (ENBL) (whichever is larger) D package 650 mW Power dissipation at TA = 25°C DGN package 3 W P package 350 mW Junction operating temperature, TJ –55 to 150 °C Storage temperature, Tstg –65 to 150 °C Lead temperature (soldering, 10 sec.) 300 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. ORDERING INFORMATION PACKAGED DEVICES OUTPUT TEMPERATURE MSOP-8 PowerPAD CONFIGURATION RANGE TA = TJ SOIC-8 (D)(1) PDIP-8 (P) (DGN)(1) –40°C to +105°C UCC27321D UCC27321DGN UCC27321P Inverting 0°C to +70°C UCC37321D UCC37321DGN UCC37321P –40°C to +105°C UCC27322D UCC27322DGN UCC27322P NonInverting 0°C to +70°C UCC37322D UCC37322DGN UCC37322P (1) D (SOIC–8) and DGN (PowerPAD–MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC37321DR, UCC37322DGNR) to order quantities of 2,500 devices per reel. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: UCC27321 UCC27322 UCC37321 UCC37322 |
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