1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

-INA

+INA

DISB

-INB

+INB

DISC

-INC

+INC

DISA

+V

S

OUTA

OUTB

+V

S

OUTC

OPA3690

SBOS237G – MARCH 2002 – REVISED MARCH 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

OPA3690ID

Rails, 48

OPA3690

SO-16

D

–40°C to +85°C

OPA3690

OPA3690IDR

Tape and Reel, 2500

OPA3690IDBQT

Tape and Reel, 250

OPA3690

SSOP-16

DBQ

–40°C to +85°C

OPA3690

OPA3690IDBQR

Tape and Reel, 2500

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see

the TI web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

OPA3690

UNIT

Power Supply

±6.5

Internal Power Dissipation

See Thermal Analysis section

Differential Input Voltage

±1.2

V

Input Voltage Range

V

Storage Temperature Range: D, DBQ

–65 to +125

°C

+150

°C

Human Body Model (HBM)

2000

V

ESD Ratings

Charge Device Model (CDM)

1500

V

Machine Model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

D AND DBQ PACKAGES

SO-16 AND SSOP-16

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2

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