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M24C02-WBN6P Datasheet(PDF) 5 Page - STMicroelectronics |
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M24C02-WBN6P Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 38 page M24C16, M24C08, M24C04, M24C02, M24C01 List of figures Doc ID 5067 Rev 17 5/38 List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5. Maximum RP value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9 Figure 6. I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 7. Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 8. Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 9. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 10. Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 11. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 12. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 13. WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 14. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 29 Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 32 |
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