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M24C02-W Datasheet(PDF) 7 Page - STMicroelectronics |
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M24C02-W Datasheet(HTML) 7 Page - STMicroelectronics |
7 / 38 page M24C16, M24C08, M24C04, M24C02, M24C01 Description Doc ID 5067 Rev 17 7/38 Figure 2. 8-pin package connections (top view) 1. NC = Not connected 2. See Section 7: Package mechanical data for package dimensions, and how to identify pin-1. 3. The Ei inputs are not decoded, and are therefore decoded as “0” (See Section 2.3: Chip Enable (E0, E1, E2) for more information). Figure 3. WLCSP and thin WLCSP connections (top view, marking side, with balls on the underside) 1. For devices of less than 16Kb (see Figure 2: 8-pin package connections (top view)), the Ei inputs are not connected to a ball, therefore the Ei input is decoded as "0" (see also Section 2.3: Chip Enable (E0, E1, E2)) Caution: EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must never be exposed to ultra violet (UV) light, since EEPROM cells loose their charge (and so their binary value) when exposed to UV light. SDA VSS SCL WC VCC AI02034F M24Cxx 1 2 3 4 8 7 6 5 16Kb / 8Kb / 4Kb / 2Kb / 1Kb NC / NC / NC / E0 / E0 NC / NC / E1 / E1 / E1 NC / E2 / E2 / E2 / E2 VCC WC SDA SCL VSS ai14908 |
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