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MLF2012C150KT Datasheet(PDF) 2 Page - TDK Electronics |
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MLF2012C150KT Datasheet(HTML) 2 Page - TDK Electronics |
2 / 10 page • All specifications are subject to change without notice. (1/9) 001-05 / 20111129 / e511_mlf_02 Inductors for Standard Circuits Multilayer/STD • Magnetic Shielded MLF Series MLF1005L Various digital devices are required to be further downsized yet remain highly functional, and to excel in low power consumption, and parts mounted on the devices are also required to have lower resistance. The MLF1005L type is a new line of inductors that have been developed to meet such requirements: their resistance has been lowered by up to 35% in comparison with that of the existing MLF1005 type. In addition, the new inductors use similar magnetic shielding, which enables their high-density mounting. FEATURES • The resistance of the MLF1005L type has been lowered by up to 35% in comparison with that of the existing MLF1005 type. • Magnetically shielded configuration allowing for high-density mounting. • Does not contain lead and is compatible with lead-free soldering. • It is a product conforming to RoHS directive. APPLICATIONS Signal processing modules such as cellular phones and tuners SPECIFICATIONS RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L ×W (3) Type name (4) Inductance (5) Tolerance (6) Packaging style (7) TDK internal code PACKAGING STYLE AND QUANTITIES HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the tempera- ture difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive Operating temperature range –40 to +85°C Storage temperature range –40 to +85°C(After mount) Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) MLF 1005 L R10 K T (1) (2) (3) (4) (5) (6) (7) 1005 1.0 ×0.5×0.5 L Low-resistance type R10 0.1 µH 1R0 1.0 µH K ±10% T Taping [reel] Packaging style Quantity Taping 10000 pieces/reel • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. |
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