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MPX200GVP Datasheet(PDF) 3 Page - Motorola, Inc |
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MPX200GVP Datasheet(HTML) 3 Page - Motorola, Inc |
3 / 8 page MPX200 SERIES 3 Motorola Sensor Device Data LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 2). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worse case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. TEMPERATURE COMPENSATION Figure 3 shows the typical output characteristics of the MPX200 series over temperature. The output is directly pro- portional to the pressure and is essentially a straight line. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This de- vice uses a unique transverse voltage diffused semiconduc- tor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differ- ences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2200 series sensors. Several approaches to external temperature compensa- tion over both – 40 to +125 °C and 0 to +80°C ranges are presented in Motorola Applications Note AN840. Figure 2. Linearity Specification Comparison Figure 3. Output versus Pressure Differential Figure 4. Cross–Sectional Diagrams (Not to Scale) 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 4.0 8.0 12 16 20 24 28 30 PRESSURE DIFFERENTIAL PSI kPa OFFSET (TYP) –40 °C +25 °C +125 °C SPAN RANGE (TYP) VS = 3.0 Vdc P1 > P2 SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIFFERENTIAL/GAUGE ELEMENT DIE BOND SILICONE GEL DIE COAT WIRE BOND LEAD FRAME ABSOLUTE DIE STAINLESS STEEL METAL COVER EPOXY CASE DIE BOND ABSOLUTE ELEMENT P1 P2 P1 P2 OFFSET (VOFF) 70 60 50 40 30 20 10 0 0 MAX POP SPAN (VFSS) PRESSURE (kPA) ACTUAL THEORETICAL LINEARITY Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel isolates the die surface and wire bond from the environment, while allowing the pressure signal to be transmitted to the silicon dia- phragm. The MPX200 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor perfor- mance and long term reliability. Contact the factory for in- formation regarding media compatibility in your application. |
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