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TLV2231CDBVRG4 Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2231CDBVRG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 30 page TLV2231, TLV2231Y Advanced LinCMOS RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS SLOS158D – JUNE 1996 – REVISED APRIL 2001 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Output Swing Includes Both Supply Rails D Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz D Low Input Bias Current ...1 pA Typ D Fully Specified for Single-Supply 3-V and 5-V Operation D Common-Mode Input Voltage Range Includes Negative Rail D High Gain Bandwidth ...2 MHz at VDD = 5 V With 600-Ω Load D High Slew Rate . . . 1.6 V/µs at VDD = 5 V D Wide Supply Voltage Range 2.7 V to 10 V D Macromodel Included description The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of bandwidth and 1.6 V/ µs of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications. The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600- Ω loads for telecom applications. With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN – terminals are on the same end of the board for providing negative feedback. Finally, gain setting resistors and the decoupling capacitor are easily placed around the package. VI VDD+ OUT IN – VDD/GND IN + C RI RF GND V+ VO 1 2 3 4 5 Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV PACKAGE (TOP VIEW) 5 4 3 1 2 IN – VDD– /GND IN + VDD+ OUT PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2001, Texas Instruments Incorporated Advanced LinCMOS is a trademark of Texas Instruments. |
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