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TPS767D301PWPG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TPS767D301PWPG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page ABSOLUTE MAXIMUM RATINGS (1) POWER DISSIPATION RATINGS TPS767D3xx SLVS209H – JULY 1999 – REVISED AUGUST 2008......................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS(1) DEVICE REGULATOR 1 VOUT (V) REGULATOR 2 VOUT (V) TPS767D301 Adjustable (1.5V – 5.5V) 3.3V TPS767D318 1.8V 3.3V TPS767D325 2.5V 3.3V (1) For the most current specifications and package information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating temperature range (unless otherwise noted). TPS767D3xx UNIT Input voltage range, V1IN, V2IN (2) –0.3 to +13.5 V Enable voltage range, V1EN, V2EN –0.3 to VIN + 0.3 V Output voltage range, V1OUT, V2OUT –0.3 to +7.0 V RESET voltage range, V1RESET, V2RESET –0.3 to +16.5 V Peak output current Internally limited ESD rating, HBM 2 kV Continuous total power dissipation See Dissipation Ratings table Operating junction temperature range, TJ –40 to +125 °C Storage temperature range, Tstg –65 to +150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network terminal ground. AIR FLOW TA ≤ +25°C DERATING FACTOR TA = +70°C TA = +85°C PACKAGE (CFM) POWER RATING ABOVE ta = +25°C POWER RATING POWER RATING 0 3.58 W 35.8 mW/°C 1.97 W 1.43 W PWP(1) 250 5.07 W 50.7 mW/°C 2.79 W 2.03 W (1) This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in × 4-in ground layer. For more information, refer to TI technical brief literature number SLMA002. 2 Submit Documentation Feedback Copyright © 1999–2008, Texas Instruments Incorporated |
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