5

Solder Reflow Temperature Profile

Regulatory Information

The HCNR200/201 optocoupler features a 0.400” wide, eight pin DIP package. This package was specifically designed

to meet worldwide regulatory requirements. The HCNR200/201 has been approved by the following organizations:

Recommended Pb-Free IR Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160 °C

140 °C

150 °C

PEAK

TEMP.

245 °C

PEAK

TEMP.

240 °C

PEAK

TEMP.

230 °C

SOLDERING

TIME

200 °C

PREHEATING TIME

150 °C, 90 + 30 SEC.

2.5 C ± 0.5 °C/SEC.

3 °C + 1 °C/–0.5 °C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.

REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.

NOTE: NON-HALIDE FLUX SHOULD BE USED.

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

* 245 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

15 SEC.

TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE

PREHEAT

60 to 180 SEC.

25

TIME

NOTES:

THE TIME FROM 25 °C to PEAK

TEMPERATURE = 8 MINUTES MAX.

NOTE: NON-HALIDE FLUX SHOULD BE USED.

UL

Recognized under UL 1577, Component Recognition

Program, FILE E55361

CSA

Approved under CSA Component Acceptance Notice

#5, File CA 88324

IEC/EN/DIN EN 60747-5-2

Approved under

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01

(Option 050 only)