DSA 30 I 150 PA

I

RMS

A

per pin

35

K/W

0.50

M

D

Nm

0.6

mounting torque

0.4

T

stg

°C

150

storage temperature

-55

Weight

g

2

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

I

is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

F

C

N

60

mounting force with clip

20

Ordering

Delivering Mode

Base Qty Code Key

Standard

Part Name

DSA 30 I 150 PA

504155

Tube

50

XXXXXX

YYWW

Logo

Marking on product

DateCode

Assembly Code

abcdef

Product Marking

D

S

A

30

I

150

PA

Part number

Diode

Schottky Diode

low VF

Single Diode

TO-220AC (2)

=

=

=

1)

1)

Marking on Product

DSA30I150PA

Current Rating [A]

Reverse Voltage [V]

=

=

=

=

RMS

IXYS reserves the right to change limits, conditions and dimensions.

20100205b

Data according to IEC 60747and per diode unless otherwise specified

© 2010 IXYS all rights reserved