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XRP6668IDBTR-F Datasheet(PDF) 8 Page - Exar Corporation

Part # XRP6668IDBTR-F
Description  1A/1A Dual Channel 1.5MHz Sync. Step Down Converter
Download  11 Pages
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Manufacturer  EXAR [Exar Corporation]
Direct Link  http://www.exar.com
Logo EXAR - Exar Corporation

XRP6668IDBTR-F Datasheet(HTML) 8 Page - Exar Corporation

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© 2011 Exar Corporation
8/11
Rev. 1.2.0
THEORY OF OPERATION
The typical application circuit of adjustable
version is shown in figure 22.
Fig. 22: Typical Application
All explanation below pertaining to one
channel
of
the
XRP6668
and
can
be
extrapolated to apply to the second channel.
INDUCTOR SELECTION
Inductor ripple current and saturation current
rating are two factors to be considered when
selecting the inductor value. A low DCR
inductor is preferred.
The inductor value L can be calculated from
the following equation:
x
1
x
1
CIN AND COUT SELECTION
A low ESR input capacitor can minimize the
input voltage ripple. Voltage rating of the
capacitor should be at least 50% higher than
the input voltage. The RMS current of the
input capacitor is required to be larger than
the IRMS calculated by:
-
The ESR value is an important parameter to
consider when selecting an output capacitor
COUT. The output ripple VOUT is determined by:
∆IL ESR
1
8 f
The output capacitor’s value can be optimized
for very low output voltage ripple and small
circuit size. Voltage rating of the capacitor
should be at least 50% higher than the output
voltage. Higher values, lower cost ceramic
capacitors are now available in smaller sizes.
These ceramic capacitors have high ripple
currents, high voltage ratings and low ESR
that make them ideal for switching regulator
applications.
It is recommended to use X5R or X7R ceramic
capacitors as they have the best temperature
and voltage characteristics.
OUTPUT VOLTAGE SELECTION
The output voltage is adjustable via the
external resistor network R1 and R2 in the
first channel and R3 and R4 in the second
channel as per the following formula:
1
R2
R1
where, VREF is the reference voltage at 0.6V.
The feedback resistors must be chosen such
that power dissipation of the resistor network
is minimal. R1 (R3 for channel 2) can be fixed
at 100kΩ and R2 (R4 for channel 2) is selected
based on the above equation.
THERMAL CONSIDERATIONS
Although thermal shutdown is built-in in
XRP6668 to protect the device from thermal
damage, the total power dissipation that
XRP6668 can sustain is based on the package
thermal capability. The formula to ensure safe
operation is shown in Note 1. To avoid
XRP6668
from
exceeding
the
maximum
junction temperature, thermal analysis is
required.
GUIDELINES FOR PCB LAYOUT
To ensure proper operation of the XRP6668,
please
note
the
following
PCB
layout
guidelines:
1. The GND, SWx and VINx traces should be
kept short, direct and wide.
2. VFBx pin must be connected directly to the
feedback resistors. Resistive divider R1/R2 and
R3/R4 must be connected in parallel to the
output capacitor COUTx.
3. The input capacitor CINx must be as close as
possible to pin VINx.
4. Keep SWx node away from the sensitive
VFB node since SWx signal experiences high
frequency voltage swings.


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