2

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Symbol

Definition

Min.

Max.

Units

High Side Floating Supply Voltage

-0.3

625

High Side Floating Offset Voltage

High Side Floating Output Voltage

Low Side and Logic Fixed Supply Voltage

-0.3

25

Logic Ground

Low Side Output Voltage

-0.3

whichever

is lower

Allowable Offset Supply Voltage Transient

—

50

V/ns

(28 Lead DIP)

—

1.5

(28 Lead SOIC)

—

1.6

W

(44 Lead PLCC)

—

2.0

Thermal Resistance, Junction to Ambient

(28 Lead DIP)

—

83

(28 Lead SOIC)

—

78

°C/W

(44 Lead PLCC)

—

63

Junction Temperature

—

150

Storage Temperature

-55

150

Lead Temperature (Soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-

eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under

board mounted and still air conditions. Additional Information is shown in Figures 7 through 10.

DT97-3 for more details).

Note 2: All input pins, CA- and CAO pins are internally clamped with a 5.2V zener diode.

Recommended Operating Conditions

The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the

with all supplies biased at 15V different

ial.

V

Symbol

Definition

Min.

Max.

Units

High Side Floating Supply Voltage

High Side Floating Offset Voltage

Note 1

600

High Side Floating Output Voltage

Low Side and Logic Fixed Supply Voltage

10

20

Logic Ground

-5

5

Low Side Output Voltage

0

Ambient Temperature

-40

125

°C

V

°C