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LM1117-5.0-252 Datasheet(PDF) 9 Page - First Components International

Part # LM1117-5.0-252
Description  800mA Low-dropout Linear Regulator Temperature Range Output Current 800mA
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Manufacturer  FCI [First Components International]
Direct Link  http://www.cotra.com.tw/
Logo FCI - First Components International

LM1117-5.0-252 Datasheet(HTML) 9 Page - First Components International

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APPLICATION NOTE (Continued)
into the output of the regulator. The discharge current de-
pends on the value of the capacitor, the output voltage of the
regulator, and rate of decrease of V
IN. In the LM1117 regu-
lators, the internal diode between the output and input pins
can withstand microsecond surge currents of 10A to 20A.
With an extremely large output capacitor (
≥1000 µF), and
with input instantaneously shorted to ground, the regulator
could be damaged.
In this case, an external diode is recommended between the
output and input pins to protect the regulator, as shown in
Figure 4.
5.0 Heatsink Requirements
When an integrated circuit operates with an appreciable cur-
rent, its junction temperature is elevated. It is important to
quantify its thermal limits in order to achieve acceptable per-
formance and reliability. This limit is determined by summing
the individual parts consisting of a series of temperature
rises from the semiconductor junction to the operating envi-
ronment. A one-dimensional steady-state model of conduc-
tion heat transfer is demonstrated in
Figure 5. The heat gen-
erated at the device junction flows through the die to the die
attach pad, through the lead frame to the surrounding case
material, to the printed circuit board, and eventually to the
ambient environment. Below is a list of variables that may af-
fect the thermal resistance and in turn the need for a heat-
sink.
RθJC(Component Vari-
ables)
RθCA (Application Vari-
ables)
Leadframe Size &
Material
Mounting Pad Size,
Material, & Location
No. of Conduction Pins
Placement of Mounting
Pad
Die Size
PCB Size & Material
Die Attach Material
Traces Length & Width
Molding Compound Size
and Material
Adjacent Heat Sources
Volume of Air
Ambient Temperatue
Shape of Mounting Pad
The LM1117 regulators have internal thermal shutdown to
protect the device from over-heating. Under all possible op-
erating conditions, the junction temperature of the LM1117
must be within the range of 0˚C to 125˚C. A heatsink may be
required depending on the maximum power dissipation and
maximum ambient temperature of the application. To deter-
mine if a heatsink is needed, the power dissipated by the
regulator, P
D , must be calculated:
I
IN =IL +IG
P
D =(VIN-VOUT)I L +VINIG
Figure 6 shows the voltages and currents which are present
in the circuit.
FIGURE 4. Regulator with Protection Diode
FIGURE 5. Cross-sectional view of Integrated Circuit
Mounted on a printed circuit board. Note that the case
temperature is measured at the point where the leads
contact with the mounting pad surface
FIGURE 6. Power Dissipation Diagram
9
LM1117 800mA Low-dropout Linear Regulator


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