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LM2937IMP-2.5 Datasheet(PDF) 10 Page - Texas Instruments |
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LM2937IMP-2.5 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 19 page LM2937-2.5, LM2937-3.3 SNVS015E – FEBRUARY 1998 – REVISED APRIL 2013 www.ti.com Figure 27. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package Figure 28. Maximum Power Dissipation vs TAMB for the SOT-223 Package Please see AN-1028 (SNVA036) for power enhancement techniques to be used with the SOT-223 package. SOT-223 SOLDERING RECOMMENDATIONS It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed circuit board. The excessive temperatures involved may cause package cracking. Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223 package. 10 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2937-2.5 LM2937-3.3 |
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