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© 2011 by RF Monolithics, Inc.

ZPM3570 Data Sheet - 05/25/11

Table of Contents

1 System Description .................................................................................................................................... 4

1.1 Applications............................................................................................................................................. 4

1.2 Module Summary.................................................................................................................................... 4

1.3 Block Diagram......................................................................................................................................... 4

1.4 Acronyms ................................................................................................................................................ 5

2 Mechanical Specifications ......................................................................................................................... 5

2.1 Module Dimensions ................................................................................................................................ 5

2.2 Module Outline Drawing ......................................................................................................................... 5

2.3 Module Bottom View ............................................................................................................................... 6

2.4 Detailed Mechanical Data (Top View) .................................................................................................... 6

2.5 Module Pin Out ....................................................................................................................................... 7

3 DC Electrical Specifications....................................................................................................................... 8

3.1 Typical Power Consumption ................................................................................................................... 8

3.2 Digital IO Specifications .......................................................................................................................... 8

4 RF Specifications ....................................................................................................................................... 9

5 Environmental Specifications..................................................................................................................... 9

5.1 Absolute Maximum Ratings .................................................................................................................... 9

5.2 Recommended Operating Conditions .................................................................................................... 9

6 Application Information ............................................................................................................................ 10

6.1 Connection Reference for the UART Host Interface ............................................................................ 10

6.2 Connection Reference for the SPI Host Interface ................................................................................ 10

6.3 Recommended Host (Customer) Circuit Board PCB Land Pattern...................................................... 11

6.4 Host PCB Layout Recommendations ................................................................................................... 12

6.5 Module Location ................................................................................................................................... 13

6.5.1 Location in x-y Plane ......................................................................................................................... 13

6.5.2 Location in z Plane ............................................................................................................................ 14

7 Assembly Information .............................................................................................................................. 14

7.1 Lead-free Reflow Soldering Profile ...................................................................................................... 14

8 Package Information ................................................................................................................................ 15

8.1 Tape and Reel Specifications ............................................................................................................... 15

9 Ordering Information ................................................................................................................................ 16

10 RoHS Declaration .................................................................................................................................. 16

11 Regulatory Information .......................................................................................................................... 16

11.1 FCC Notice (USA) .............................................................................................................................. 16

11.1.1 FCC Labeling Requirements ........................................................................................................... 17

11.1.2 RF Exposure .................................................................................................................................... 17

11.2 IC Notice (CANADA)........................................................................................................................... 17

11.3 CE Notice (EUROPE) ......................................................................................................................... 18

12 Technical Support Contact .................................................................................................................... 18

13 References............................................................................................................................................. 18