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MF-MSMF110-4X Datasheet(PDF) 3 Page - Bourns Electronic Solutions

Part # MF-MSMF110-4X
Description  Surface mount packaging for automated assembly
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Manufacturer  BOURNS [Bourns Electronic Solutions]
Direct Link  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

MF-MSMF110-4X Datasheet(HTML) 3 Page - Bourns Electronic Solutions

  MF-MSMF110-4X Datasheet HTML 1Page - Bourns Electronic Solutions MF-MSMF110-4X Datasheet HTML 2Page - Bourns Electronic Solutions MF-MSMF110-4X Datasheet HTML 3Page - Bourns Electronic Solutions MF-MSMF110-4X Datasheet HTML 4Page - Bourns Electronic Solutions MF-MSMF110-4X Datasheet HTML 5Page - Bourns Electronic Solutions  
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MF-MSMF Series - PTC Resettable Fuses
A
B
C
Top and Bottom View
Side View
D
Top View
Style 2
Style 1
Bottom View
Side View
Recommended Pad Layout
8
C
A
B
D
C
2.95 ± 0.10
(.114 ± .004)
3.1 ± 0.10
(.122 ± .004)
1.68 ± 0.05
(.066 ± .002)
Recommended Pad Layout
3.2 ± 0.1
(0.126 ± .004)
2.7 ± 0.1
(.106 ± .004)
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Product Dimensions (see previous page for dimensions)
Typical Time to Trip at 23 ˚C
0.001
0.01
0.1
1
10
100
0.1
1
10
100
MF-MSMF020
MF-MSMF030
MF-MSMF200
MF-MSMF014
MF-MSMF010
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF260
Fault Current (Amps)
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specific customer applications may differ
from these values due to the influence of
other variables.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.


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