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FQI13N06 Datasheet(PDF) 1 Page - Fairchild Semiconductor

Part # FQI13N06
Description  60V N-Channel MOSFET
Download  9 Pages
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Manufacturer  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FQI13N06 Datasheet(HTML) 1 Page - Fairchild Semiconductor

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May 2001
QFETTM
©2001 Fairchild Semiconductor Corporation
Rev. A1. May 2001
FQB13N06 / FQI13N06
60V N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as DC/DC
converters,
high
efficiency
switching
for
power
management in portable and battery operated products.
Features
• 13A, 60V, RDS(on) = 0.135Ω @VGS = 10 V
• Low gate charge ( typical 5.8 nC)
• Low Crss ( typical 15 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175
°C maximum junction temperature rating
! "
!
!
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Absolute Maximum Ratings T
C = 25°C unless otherwise noted
Thermal Characteristics
Symbol
Parameter
FQB13N06 / FQI13N06
Units
VDSS
Drain-Source Voltage
60
V
ID
Drain Current
- Continuous (TC = 25°C)
13
A
- Continuous (TC = 100°C)
9.2
A
IDM
Drain Current
- Pulsed
(Note 1)
52
A
VGSS
Gate-Source Voltage
± 25
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
85
mJ
IAR
Avalanche Current
(Note 1)
13
A
EAR
Repetitive Avalanche Energy
(Note 1)
4.5
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
7.0
V/ns
PD
Power Dissipation (TA = 25°C) *
3.75
W
Power Dissipation (TC = 25°C)
45
W
- Derate above 25°C
0.3
W/°C
TJ, TSTG
Operating and Storage Temperature Range
-55 to +175
°C
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C
Symbol
Parameter
Typ
Max
Units
RθJC
Thermal Resistance, Junction-to-Case
--
3.35
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient *
--
40
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
--
62.5
°C/W
* When mounted on the minimum pad size recommended (PCB Mount)
S
D
G
D2-PAK
FQB Series
I2-PAK
FQI Series
G
S
D
G
S
D


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