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SMC30J6.0A Datasheet(PDF) 5 Page - STMicroelectronics |
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SMC30J6.0A Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 10 page SMC30J Characteristics Doc ID 022064 Rev 1 5/10 Figure 11. Leakage current versus junction temperature (typical values) Figure 9. Relative variation of thermal impedance, junction to ambient, versus pulse duration Figure 10. Thermal resistance junction to ambient versus copper surface under each lead 0.01 0.10 1.00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 t (s) p Recommended pad layout Single pulse Z/R th(j-a) th(j-a) epoxy printed board, FR4 copper thickness = 35 µm 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm ) Cu 2 epoxy printed board, FR4 copper thickness = 35 µm 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 25 50 75 100 125 150 I (nA) R V= V RRM V < 10 V RM V10 V RM ≥ T (°C) j |
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