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82575EB Datasheet(PDF) 10 Page - Intel Corporation |
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82575EB Datasheet(HTML) 10 Page - Intel Corporation |
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10 / 62 page  Intel® 82575EB Gigabit Ethernet Controller — Additional Device Features Intel® 82575EB Gigabit Ethernet Controller 317679-004 Datasheet Revision: 2.11 10 January 2011 2.6 Additional Device Features 2.7 Technology Features * For information about operating the 82575EB outside of this range, please refer to the 82575EB Thermal Management Application Note. Features Benefits Two complete Gigabit Ethernet connections in a single device • Inherent dual port teaming ability • High availability using one port for failover • Higher throughput than single Gigabit Ethernet port • Lower latency due to one electrical load on the bus • Saves critical board space • Reduced multi-port Gigabit Ethernet costs Integrated SERDES • Supports backplane and fiber applications as well as copper-based Gigabit via the SGMII interface Four activity and link indication outputs (per port) that directly drive LEDs • Link and activity indications (10, 100, and 1000 Mbps) on each port Programmable LED functionality • Software definable function (speed, link, and activity) and blinking allowing flexible LED implementations Internal PLL for clock generation can use a 25 MHz crystal • Lower component count and system cost JTAG (IEEE 1149.1) Test Access Port built in silicon • Simplified testing using boundary scan • Supports the IDCODE instruction Four software definable pins per port • Additional flexibility for LEDs or other low speed I/O devices Provides loopback capabilities • Validates silicon integrity Four-wire SPI EEPROM interface • Standard Features Benefits 576-pin Flip-Chip Ball Grid Array (FC-BGA) package • 25 mm X 25 mm Operating temperature: 1000BASE-T, 0 °C to 55 °C* 1000BASE-SX/LX (or SERDES backplane), 0 °C to 70 °C Storage temperature 65 °C to 140 °C • Simple thermal design Typical targeted power dissipation: 2.43 W @ D0 1000 Mbps 0.79 W @ D3cold 100 Mbps (wakeup enabled) 0.29 W @ D3cold (wakeup disabled) • Conditions: FF materials, nominal voltage, 115 °C • Minimizes impact of incorporating Gigabit instead of Fast Ethernet. Maxmum Payload Size: 128 and 256 Max number of transactions (TLP) supported on PCIe: Four TX DMA requests + 1 TX descriptor + 1 RX descriptor. |
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