TPS51285A

TPS51285B

SLVSBX0 – APRIL 2013

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ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VBST1, VBST2

–0.3

32

–0.3

6

SW1, SW2

–6

26

VIN

–0.3

26

V

EN1, EN2

–0.3

6

VFB1, VFB2

–0.3

3.6

VO1

–0.3

6

DRVH1, DRVH2

–6.0

32

–0.3

6

–2.5

6

DRVL1, DRVL2

–0.3

6

V

DRVL1, DRVL2 (duty cycle < 1%)

–2.5

6

PGOOD, VCLK, VREG5

–0.3

6

VREG3, CS1, CS2

–0.3

3.6

Human Boby Model (HBM)

2

Electrostatic discharge

kV

Charged Device Model (CDM)

0.5

150

°C

–55

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted

(3)

Voltage values are with respect to SW terminals.

(4)

ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

TPS51285A

TPS51285B

UNITS

20-PIN RUK

Junction-to-ambient thermal resistance

46.2

Junction-to-case (top) thermal resistance

53.6

Junction-to-board thermal resistance

19.2

°C/W

Junction-to-top characterization parameter

0.6

Junction-to-board characterization parameter

19.2

Junction-to-case (bottom) thermal resistance

3.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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