TPS55330

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SLVSBX8 – MAY 2013

MINIMUM ON TIME AND PULSE SKIPPING

The TPS55330 PWM control system has a minimum PWM pulse width of 77ns (typical). This minimum on-time

determines the minimum duty cycle of the PWM, for any set switching frequency. When the voltage regulation

loop of the TPS55330 requires a minimum on-time pulse width less than 77ns, the IC enters pulse-skipping

mode. In this mode, the device will hold the power switch off for several switching cycles to prevent the output

voltage from rising above the desired regulated voltage. This operation typically occurs in light load conditions

when the PWM operates in discontinuous conduction mode. Pulse skipping increases the output ripple as shown

in Figure 21.

LAYOUT COSIDERATIONS

As for all switching power supplies, especially those with high frequency and high switch current, printed circuit

board (PCB) layout is an important design step. If the layout is not carefully designed, the regulator could suffer

from instability as well as noise problems. To maximize efficiency, switch rise and fall times are made as short as

possible. To prevent radiation of high frequency resonance problems, proper layout of the high frequency

switching path is essential. Minimize the length and area of all traces connected to the SW pin and always use a

ground plane under the switching regulator to minimize inter-plane coupling. The high current path including the

internal MOSFET switch, Schottky diode, and output capacitor, contains nanosecond rise and fall times and

should be kept as short as possible. The input capacitor needs not only to be close to the VIN pin, but also to the

AGND pin in order to reduce the IC supply ripple.

THERMAL CONSIDERATIONS

The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. This

restriction limits the power dissipation of the TPS55330. The TPS55330 features a thermally enhanced QFN

package. This package includes a PowerPad™ that improves the thermal capabilities of the package. The

thermal resistance of the QFN package in any application greatly depends on the PCB layout and the

PowerPad™ connection. The PowerPad™ must be soldered to the analog ground on the PCB. Use thermal vias

underneath the PowerPad™ to achieve good thermal performance.

Copyright © 2013, Texas Instruments Incorporated

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