D2TO35

www.vishay.com

Vishay Sfernice

Revision: 22-Apr-13

1

Document Number: 51058

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Surface Mount Power Resistor

Thick Film Technology

FEATURES

• AEC-Q200 qualified

• 35 W at 25 °C case temperature

package

• Wide resistance range from 0.01

 to 550 k

• Non inductive

• Resistor isolated from metal tab

• Solder reflow secure at 270 °C/10 s

• Material categorization: For definitions of compliance

Notes

• For the asssembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C

• Power dissipation is 3.3 W at an ambient temperature of 25 °C when mounted on a double sided copper board using FR4 standard, 70 μm

of copper, 39 mm x 30 mm x 1.6 mm

DIMENSIONS in millimeters

STANDARD ELECTRICAL SPECIFICATIONS

MODEL

SIZE

RESISTANCE

RANGE



RATED POWER

W

LIMITING ELEMENT

V

TOLERANCE

± %

TEMPERATURE

COEFFICIENT

± ppm/°C

CRITICAL

RESISTANCE



D2TO35

TO-263

0.01 to 550K

35

500

1, 2, 5, 10

150, 250, 700, 1100

7.14K

10.5

1.6

8.8

1.6

Tolerance: ± 0.3 mm

11.00

1.50

6.50

4.02

4.00

2.40

8.00

2.49

0.26

Footprint recommendation for

solderable contact area:

1.25

4.5

2.8

2.2

0.3

2

5.08

7.6

7.8 min.

8.7

0.2

10.1

MECHANICAL SPECIFICATIONS

Mechanical Protection

Molded

Resistive Element

Thick film

Substrate

Alumina

Connections

Tinned copper

Weight

2.2 g max.

ENVIRONMENTAL SPECIFICATIONS

Temperature Range

- 55 °C to 175 °C

Flammability

IEC 60695-11-5

2 applications 30 s

separated by 60 s

TECHNICAL SPECIFICATIONS

Power Rating and



Thermal Resistance



of the Component

35 W at 25 °C (case

temperature)

Temperature Coefficient

See Special Feature table

Standard

± 150 ppm/°C

Dielectric Strength



IEC 60115-1

(between terminals and board)

Insulation Resistance

Inductance

 0.1 μH

DIMENSIONS

Standard Package

TO-263 style