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D2TO035CR6800FRE3 Datasheet(PDF) 2 Page - Vishay Siliconix |
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D2TO035CR6800FRE3 Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 6 page D2TO35 www.vishay.com Vishay Sfernice Revision: 22-Apr-13 2 Document Number: 51058 For technical questions, contact: sfer@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SPECIAL FEATURES Resistance Values 0.010 0.045 0.1 0.5 Tolerances ± 1 % at ± 10 % Requirement Temperature Coefficient (TCR) (- 55 °C + 150 °C) IEC 60115-1 ± 1100 ppm/°C ± 700 ppm/°C ± 250 ppm/°C ± 150 ppm/°C PERFORMANCE TESTS CONDITIONS REQUIREMENTS Momentary Overload IEC 60115-1 §4.13 1.7 Pr 5 s for R < 2 1.4 Pr 5 s for R 2 US < 1.5 UL ± (0.25 % + 0.005 ) Load Life IEC 60115-1 1000 h, 90/30 Pr at + 25 °C ± (1 % + 0.005 ) High Temperature Exposure AEC-Q200 REV C conditions: MIL-STD-202 method 108 1000 h, + 175 °C, unpowered ± (0.25 % + 0.005 ) Temperature Cycling Pre-conditioning 3 reflows according JESTD020D IEC 60068-2-14 test Na 1000 cycles, - 55 °C, + 175 °C Dwell time - 15 min ± (0.5 % + 0.005 ) Moisture Resistance AEC-Q200 REV C conditions: MIL-STD-202 method 106 10 cycles, 24 h, unpowered ± (0.5 % + 0.005 ) Biased Humidity AEC-Q200 REV C conditions: MIL-STD-202 method 103 1000 h, 85 °C, 85% RH ± (1 % + 0.005 ) Operational Life AEC-Q200 REV C conditions: Pre-conditioning 3 reflows according JESTD020D MIL-STD-202 method 108 1000 h, 90/30, powered, + 125 °C ± (1 % + 0.005 ) ESD Human Body Model AEC-Q200 REV C conditions: AEC-Q200-002 25 kVAD ± (0.5 % + 0.005 ) Vibration AEC-Q200 REV C conditions: MIL-STD-202 method 204 5 g’s for 20 min, 12 cycles test from 10 Hz to 2000 Hz ± (0.5 % + 0.005 ) Mechanical Shock AEC-Q200 REV C conditions: MIL-STD-202 method 213 100 g’s, 6 ms, 3.75 m/s 3 shocks/direction ± (0.5 % + 0.005 ) Board Flex AEC-Q200 REV C conditions: AEC-Q200-005 bending 2 mm, 60 s ± (0.25 % + 0.01 ) Terminal Strength AEC-Q200 REV C conditions: AEC-Q200-006 1.8 kgf, 60 s ± (0.25 % + 0.01 ) ASSEMBLY SPECIFICATIONS For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C TESTS CONDITIONS REQUIREMENTS Resistance to Soldering Heat IEC 60115-1 IEC 60068-2-58 Solder bath method: 270 °C/10 s ± (0.5 % + 0.005 ) Moisture Sensitivity Level (MSL) IPC/JEDEC J-STD-020C 85 °C/85 % RH/168 h Level: 1 + pass requirements of TCR overload and dielectic strength after MSL |
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