© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 04/24/13

Low Capacitance ESD Protection - SP3012 Series

Package Dimensions— µDFN-10 (2.5x1.0x0.5mm)

Package

µDFN-10 (2.5x1.0x0.5mm)

JEDEC

MO-229

Symbol

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

A

0.48

0.515

0.55

0.019

0.020

0.021

A1

0.00

--

0.05

0.000

0.022

A3

0.125 Ref

0.005 Ref

b

0.15

0.20

0.25

0.006

0.008

0.012

b1

0.35

0.40

0.45

0.014

0.016

0.018

D

2.40

2.50

2.60

0.094

0.098

0.102

E

0.90

1.00

1.10

0.035

0.039

0.043

e

0.50 BSC

0.020 BSC

L

0.30

0.365

0.43

0.012

0.014

0.016

D

E

B

Top View

A

A

Bottom View

0.05 C

b

A1

b1

A3

C

Seating

Plane

Side View

0.10

C A

M

B

0.05

C

M

L

e

2xR0.075mm (7x)

R0.125

0.05 C

X1

X

P

P1

Z (C) G

Y

(Y1)

Soldering Pad Layout

Recomended

D

E

B

Top View

A

A

Bottom View

0.05 C

b

A1

b1

A3

C

Seating

Plane

Side View

0.10

C A

M

B

0.05

C

M

L

e

2xR0.075mm (7x)

R0.125

0.05 C

X1

X

P

P1

Z (C) G

Y

(Y1)

Soldering Pad Layout

Recomended

Soldering Pad Layout Dimensions

Inch

Millimeter

C

(0.034)

(0.875)

G

0.008

0.20

P

0.020

0.50

P1

0.039

1.00

X

0.008

0.20

X1

0.016

0.40

Y

0.027

0.675

Y1

(0.061)

(1.55)

Z

0.061

1.55

X1

X

P

P1

Z (C) G

Y

(Y1)

Soldering Pad Layout

Alternative

Embossed Carrier Tape & Reel Specification— µDFN-10

Package

µDFN-10 (2.5x1.0x0.5mm)

Symbol

Millimeters

A0

1.30 ± 0.10

B0

2.83 ± 0.10

D0

Ø 1.50 + 0.10

D1

Ø 1.00 + 0.25

E

1.75 ± 0.10

F

3.50 ± 0.05

K0

0.65 ± 0.10

P0

4.00 ± 0.10

P1

4.00 ± 0.10

P2

2.00 ± 0.05

T

0.254 ± 0.02

W

8.00 + 0.30 /- 0.10

A0

P2

P1

P0

T

D1

5º Max

5º Max

User Feeding Direction

Pin 1 Location