MAX16930/MAX16931

2MHz, 36V, Dual Buck with Preboost and

20µA Quiescent Current

2

Maxim Integrated

IN, INS, CS3P, CS3N, FB3, EN1, EN2,

EN3, TERM to PGND_ .......................................-0.3V to +42V

CS1, CS2, OUT1, OUT2 to AGND ........................-0.3V to +11V

CS1 to OUT1 ........................................................-0.2V to +0.2V

CS2 to OUT2 ........................................................-0.2V to +0.2V

CS3P to CS3N......................................................-0.2V to +0.2V

BIAS, FSYNC, FOSC to AGND.............................-0.3V to +6.0V

COMP1, COMP2, BSTON to AGND.....................-0.3V to +6.0V

FB1, FB2, FSELBST, EXTVCC to AGND ..............-0.3V to +6.0V

DL_ to PGND_ .....................................................-0.3V to +6.0V

BST_ to LX_ ........................................................-0.3V to + 6.0V

DH_ to LX_ ..........................................................-0.3V to + 6.0V

LX_ to PGND_ .......................................................-0.3V to +42V

PGND_ to AGND..................................................-0.3V to +0.3V

PGOOD1, PGOOD2 to AGND.......... ...................-0.3V to +6.0V

TQFN (derate 35.7mW/NC above +70NC)..................2857mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature Range..........................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow)...................................... +260NC

TQFN

Junction-to-Ambient Thermal Resistance (

Junction-to-Case Thermal Resistance (

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNIT

SYNCHRONOUS STEP-DOWN DC-DC CONVERTERS

Supply Voltage Range

Normal operation

3.5

36

V

t < 1s

42

With preboost after initial startup condition

is satisfied

2.0

36

Supply Current

8

20

F

A

30

40

20

30

no switching

25

40

Buck 1 Fixed Output Voltage

4.95

5

5.05

V

4.95

5

5.075

Buck 2 Fixed Output Voltage

3.234

3.3

3.366

V

3.234

3.3

3.4

Output Voltage Adjustable

Range

Buck 1, buck 2

1

10

V