WIRE-WOUND

RF CHIP INDUCTORS

Performance Specifications

Samplers are subjected to random

vibration as per NAVMAT P9492

Inductors are subjected to one half

sine wave pulse (8700 g's for

0.3 ms) in each directional axis

for a total of 18 shocks

Reflow Inductors on to test pads

using 63 Sn/37 Pb solder paste

(IR Reflow profile = 200°C for

30 seconds or peak 235°C for 20

seconds)

Mechanical Testing

Tape and Reel Specifications

A

C

B

D

E

P1

P2

P3

W

H

T

Packaging Specifications

Series

Parts per

Reel Dimensions (mm)

Tape Dimensions (mm)

Reel

A

B

C

D

E

W

P1

P2

P3

H

T

0402CD

3000

178

50

13

14.4

8.4

8

2

4

4

1.1

0.3

0603CD

2000

178

50

13

14.4

8.4

8

2

4

4

1.7

0.3

0805CD

2000

178

50

13

14.4

8.4

8

2

4

4

2.1

0.3

0805CM

2000

178

50

13

14.4

8.4

8

2

4

4

2.1

0.3

0805FT

2000

178

50

13

14.4

8.4

8

2

4

4

2.1

0.3

1008CD

1600

178

50

13

14.4

8.4

8

2

4

4

2.6

0.3

1008CM

1600

178

50

13

14.4

8.4

8

2

4

4

2.6

0.3

1008CQ

1600

178

50

13

14.4

8.4

8

2

4

4

2.6

0.3

1206CD

3000

330

101

13

18.4

12.4

12

2

4

4

2.0

0.4

NOTE: P1, P2 and P3 are same for all chip inductor series. Keeping the same dimensions for guide hole and pocket pitch (P1), pocket pitch (P2), guide

hole pitch (P3) and tape width (8mm) for all series, enables the packaging machine to maintain the same settings while changing models. The only differ-

ence between the series are the parts per reel which contribute to a different length of tapes/reel per model.

Vibration (Random)

Mechanical Shock

Moisture Resistance

There shall be no deformation

or change in appearance

Inductance shall not change

by more than ±5%

Q values shall not change

by more than ±10%

The inductors shall withstand

a minimum force of 1000 g's in any

direction using a dynamometer

force guage.

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WC701.L (4/10)