DCT PACKAGE

(TOP VIEW)

DCU PACKAGE

(TOP VIEW)

YZP PACKAGE

(TOP VIEW)

CLK

1

8

V

CC

CLK

1

8

D

2

7

PRE

D

2

7

PRE

Q

3

6

CLR

D

Q

GND

B1

C1

D1

PRE

CLR

Q

Q

3

6

CLR

GND

4

5

Q

GND

4

5

Q

See mechanical drawings for dimensions.

DQE PACKAGE

(TOP VIEW)

CLK

1 8

V

CC

D

Q

GND

2

7

3

6

4 5

PRE

CLR

Q

RSE PACKAGE

(TOP VIEW)

CLK

1

8

V

CC

D

Q

GND

2

7

3

6

4

5

PRE

CLR

Q

SN74LVC1G74

www.ti.com

SCES794C – SEPTEMBER 2009 – REVISED NOVEMBER 2012

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

WITH CLEAR AND PRESET

Check for Samples: SN74LVC1G74

1

FEATURES

2

•

Available in the Texas Instruments NanoFree™

•

Package

Down Mode, and Back Drive Protection

•

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

Inputs Accept Voltages to 5.5 V

•

ESD Protection Exceeds JESD 22

•

–

2000-V Human-Body Model (A114-A)

•

Low Power Consumption, 10-

–

200-V Machine Model (A115-A)

•

±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

•

•

DESCRIPTION/ORDERING INFORMATION

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the

other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time

requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs

at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,

data at the D input can be changed without affecting the levels at the outputs.

preventing damaging current backflow through the device when it is powered down.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2009–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.