DISCLAIMER

AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR

SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OP-

ERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RE-

SPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,

EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

Handling Precaution

The encapsulation material of the product is made of sili-

cone for better reliability of the product. As silicone is a

soft material, please do not press on the silicone or poke

a sharp object onto the silicone. These might damage

the product and cause premature failure. During as-

sembly or handling, the unit should be held on the body

only. Please refer to Avago Application Note AN5288 for

detail information.

Moisture Sensitivity

This product is qualified as Moisture Sensitive Level 2a

for InGaN devices and MSL 4 for AlInGaP devices per

Jedec J-STD-020. Precautions when handling this mois-

ture sensitive product is important to ensure the reliabil-

ity of the product. Do refer to Avago Application Note

AN5305 Handling of Moisture Sensitive Surface Mount

Devices for details.

A. Storage before use

• Unopen moisture barrier bag (MBB) can be stored

at <40°C/90%RH for 12 months. If the actual shelf

life has exceeded 12 months and the humidity

indicator card (HIC) indicates that baking is not

required, then it is safe to reflow the LEDs per the

original MSL rating.

• It is not recommended to open the MBB prior to

assembly (e.g. for IQC).

For product information and a complete list of distributors, please go to our web site:

www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0129EN

- December 10, 2012

B. Control after opening the MBB

• The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

• The LEDs must be kept at <30°C/60%RH at all time

and all high temperature related process including

soldering, curing or rework need to be completed

within 672 hours for MSL 2a and 72 hours for MSL

4.

C. Control for unfinished reel

• For any unused LEDs, they need to be stored in

sealed MBB with desiccant or desiccator at <5%RH.

D. Control of assembly boards

• If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, the PCB

need to be stored in sealed MBB with desiccant

or desiccator at <5%RH to ensure no LEDs have

exceeded their floor life of 672 hours for MSL 2a

and 72 hours for MSL 4.

E. Baking is required if

• HIC “10%” indicator is not blue and “5%” indicator

is pink. - The LEDs are exposed to condition of

>30°C/60% RH at any time.

• The LEDs floor life exceeded 672 hours for MSL 2a

and 72 hours for MSL 4.

Recommended baking condition: 60±5ºC for 20hrs.