NX3008PBK

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Product data sheet

Rev. 1 — 1 August 2011

5 of 16

NXP Semiconductors

NX3008PBK

30 V, 230 mA P-channel Trench MOSFET

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to ambient

in free air

[1] -310

370

K/W

[2] -260

300

K/W

thermal resistance from junction to solder

point

--115

K/W

FR4 PCB, standard footprint

Fig 4.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Fig 5.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

017aaa015

10

1

10

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0

017aaa016

10

1

10

(K/W)

1

duty cycle = 1

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

0