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H11G3SD Datasheet(PDF) 6 Page - Fairchild Semiconductor |
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H11G3SD Datasheet(HTML) 6 Page - Fairchild Semiconductor |
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6 / 7 page  MARKING INFORMATION Reflow Profile (Black Package, No Suffix) H11G1 V XX YY K 1 2 6 4 3 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 Two digit year code, e.g., ‘03’ 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code • Peak reflow temperature: 225 °C (package surface temperature) • Time of temperature higher than 183 °C for 60–150 seconds • One time soldering reflow is recommended 215 °C, 10–30 s 225 C peak Time (Minute) 0 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time above 183 °C, 60–150 sec Ramp up = 3C/sec |
Similar Part No. - H11G3SD |
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Similar Description - H11G3SD |
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