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LM1117IMPX-3.3 Datasheet(PDF) 11 Page - Texas Instruments

Part # LM1117IMPX-3.3
Description  800mA Low-Dropout Linear Regulator
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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LM1117IMPX-3.3 Datasheet(HTML) 11 Page - Texas Instruments

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LM1117-N, LM1117I
www.ti.com
SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013
Figure 22. Regulator with Protection Diode
HEATSINK REQUIREMENTS
When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is
important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is
determined by summing the individual parts consisting of a series of temperature rises from the semiconductor
junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is
demonstrated in Figure 23. The heat generated at the device junction flows through the die to the die attach pad,
through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the
ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a
heatsink.
R
θJC (Component Variables)
R
θCA (Application Variables)
Leadframe Size & Material
Mounting Pad Size, Material, & Location
No. of Conduction Pins
Placement of Mounting Pad
Die Size
PCB Size & Material
Die Attach Material
Traces Length & Width
Molding Compound Size and Material
Adjacent Heat Sources
Volume of Air
Ambient Temperatue
Shape of Mounting Pad
The case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 23. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board
The LM1117-N regulators have internal thermal shutdown to protect the device from over-heating. Under all
possible operating conditions, the junction temperature of the LM1117-N must be within the range of 0°C to
125°C. A heatsink may be required depending on the maximum power dissipation and maximum ambient
temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD ,
must be calculated:
IIN = IL + IG
(2)
Copyright © 2000–2013, Texas Instruments Incorporated
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Product Folder Links: LM1117-N LM1117I


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