Design, Specifications are subject to change without notice.

Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

ERJ1G(0201)

0.3 to 0.4

0.8 to 0.9

0.25 to 0.35

ERJ2G(0402)

0.5 to 0.6

1.4 to 1.6

0.4 to 0.6

ERJ3G(0603)

0.7 to 0.9

2 to 2.2

0.8 to 1

ERJ6G(0805)

1 to 1.4

3.2 to 3.8

0.9 to 1.4

ERJ8G(1206)

2 to 2.4

4.4 to 5

1.2 to 1.8

ERJ14(1210)

2 to 2.4

4.4 to 5

1.8 to 2.8

ERJ12(1812)

3.3 to 3.7

5.7 to 6.5

2.3 to 3.5

ERJ12Z(2010)

3.6 to 4

6.2 to 7

1.8 to 2.8

ERJ1T(2512)

5 to 5.4

7.6 to 8.6

2.3 to 3.5

Thick Film Chip Resistors

In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount

properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering,

solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W).

1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and

confirmation test with the resistors actually mounted on your own board.

When the load of more than rated power is applied under the load condition at steady state, it may

impair performance and/or reliability of resistor.

Never exceed the rated power.

2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of

resistors.

3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When

using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less

up to 350 ¡C).

4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may

damage protective film or the body of resistor and may affect resistorÕs performance.

Chip Resistor

a

b

Type

(inches)

Dimensions (mm)

ab

c

Cautions for Safety

Recommendations and precautions are described below.

Preheating

Peak

Heating

Time

q Recommended soldering conditions for reflow

áReflow soldering shall be two times maximum.

áPlease contact us for additional information when you

use in conditions other than those specified.

áPlease measure a temperature of terminations and study

solderability every kind of solder and board, before actual

use.

Temperature

Time

Preheating

140 ¡C to 160 ¡C

60 s to 120 s

Main heating

Above 200 ¡C

30 s to 40 s

Peak

235 ± 5 ¡C

max. 10 s

Temperature

Time

Preheating

150 ¡C to 180 ¡C

60 s to 120 s

Main heating

Above 230 ¡C

30 s to 40 s

Peak

max. 260 ¡C

max. 10 s

For solder (Example : Sn/Pb)

For lead-free solder (Example : Sn/Ag/Cu)

q Recommended soldering conditions for flow

For solder

For lead-free solder

Temperature

Time

Temperature

Time

Preheating

140 ¡C to 160 ¡C

60 s to 120 s

150 ¡C to 180 ¡C

60 s to 120 s

Soldering

245±5 ¡C

20 s to 30 s

max. 260 ¡C

max. 10 s