Chip RC Networks

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Preheating

Peak

Heating

Time

Recommendations and precautions are described below.

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,

Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.

1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)

so as not to damage their electrodes and protective coatings.

Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.

2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC networks' performance

and/or reliability.

3. Perform sufficient preheating so that the difference of the solder temperature and the RC networks chip surface

temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by

immersion into solvent after soldering.

4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When

using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at

350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.

6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'

protective coatings and bodies may be chipped, affecting their performance.

7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.

8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to

dielectric materials having a high dielectric constant.

Safety Precautions

● Flow Soldering

We do not recommend flow soldering to the product, because solder bridging may occur due to the

narrow pitch of the terminals and the characteristics of the product may be badly affected when using

adhesive to affix it to a circuit board.

● Recommended soldering conditions for reflow

·R

eflow soldering shall be performed a maximum of

two times.

·Please contact us for additional information when

used in conditions other than those specified.

·Please measure the temperature of the terminals and

study every kind of solder and printed circuit board

for solderability before actual use.

For soldering (Example : Sn/Pb)

Temperature

Time

Preheating

140 °C to 160 °C

60 s to120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 5 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 180 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

This product has circuits on both sides. Therefore, do not use

adhesives because they may impair the products characteristics.

For lead-free soldering (Example : Sn/Ag/Cu)

Feb. 2006