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AYF33

ACCTB47E 201303-T

• Y3B Dimension table (Unit: mm)

• Y3BW Dimension table (Unit: mm)

• Connector orientation with respect to embossed tape feeding direction

NOTES

Number of pins

Type of taping

A

B

C

Quantity per reel

7 to 17

Tape I

16.00

7.50

17.40

5,000

21 to 45

Tape I

24.00

11.50

25.40

5,000

51, 61

Tape II

32.00

14.20

33.40

5,000

Number of pins

Type of taping

A

B

C

Quantity per reel

11

Tape I

16.00

7.50

17.40

5,000

25

Tape I

24.00

11.50

25.40

5,000

51

Tape II

32.00

14.20

33.40

5,000

• Specifications for taping

• Specifications for the plastic reel

(In accordance with EIAJ ET-7200B.)

28.40

(B)

(B)

(1.75)

(1.75)

(A

±0.3)

Tape I

Tape II

(A

±0.3)

Embossed mounting-hole

Taping reel

Top cover tape

Embossed carrier tape

(C

±1)

Label

Type

Direction

of tape progress

Y3B

Y3BW

1. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.3 mm or 0.5 mm.

In order to reduce solder and flux rise,

solder bridges and other issues make

sure the proper levels of solder is used.

The figures to the right are recommended

metal mask patterns. Please use them as

a reference.

• Y3B

No. of pins: Odd number

Recommended PC board pattern

(mounting layout)

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 120

µm

(Front terminal portion opening area ratio: 96%)

(Back terminal portion opening area ratio: 96%)

No. of pins: Even number (8 pins)

Recommended PC board pattern

(mounting layout)

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 120

µm

(Front terminal portion opening area ratio: 96%)

(Back terminal portion opening area ratio: 96%)

0.60

±0.03

0.60

±0.03

0.23

±0.03

0.23

±0.03

0.60

±0.01

0.22

±0.01

0.60

±0.01

0.22

±0.01

0.60

±0.03

0.23

±0.03

0.60

±0.03

0.23

±0.03

0.60

±0.01

0.22

±0.01

0.60

±0.01

0.22

±0.01