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AYF533865 Datasheet(PDF) 6 Page - Panasonic Semiconductor |
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AYF533865 Datasheet(HTML) 6 Page - Panasonic Semiconductor |
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6 / 6 page  Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ ACCTB13E 201204-T Notes on Using FPC Connectors (Common) PC board design Design the recommended foot pattern in order to secure the mechanical strength in the soldered areas of the terminal. FPC and equipment design Design the FPC based with recommended dimensions to ensure the required connector performance. When back lock type is used, secure enough space for closing the lever and for open-close operation of the lever. Due to the FPC size, weight, or the reaction force of the routed FPC. Carefully check the equipment design and take required measures to prevent the FPC from being removed due to a fall, vibration, or other impact. Connector mounting Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. Soldering 1) Manual soldering. • Due to the connector’s compact size, if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. • Make sure that the soldering iron tip is heated within the temperature and time limits indicated in the specifications. • Flux from the solder wire may adhere to the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any flux before use. • Be aware that a load applied to the connector terminals while soldering may displace the contact. • Thoroughly clean the iron tip. 2) Reflow soldering • Screen-printing is recommended for printing paste solder. • To achieve the appropriate soldering state, make sure that the reflow temperature, PC board foot pattern, window size and thickness of metal mask are recommended condition. • Note that excess solder on the terminals prevents complete insertion of the FPC, and that excess solder on the soldering terminals prevents the lever from rotating. • Consult us when using a screen-printing thickness other than that recommended. • Depending on the size of the connector being used, self alignment may not be possible. Accordingly, carefully position the terminal with the PC board pattern. • The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile • The temperature is measured on the surface of the PC board near the connector terminal. • Certain solder and flux types may cause serious solder creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. • When performing reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector using, for example, an adhesive. (Double reflow soldering on the same side is possible) 3) Reworking on a soldered portion • Finish reworking in one operation. • For reworking of the solder bridge, use a soldering iron with a flat tip. Do not add flux, otherwise the flux may creep to the contact parts. • Use a soldering iron whose tip temperature is within the temperature range specified in the specifications. Do not drop or handle the connector carelessly. Otherwise, the terminals may become deformed due to excessive force or applied solderability may be during reflow degrade. Don’t open/close the lever or insert/ remove an FPC until the connector is soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. In addition, do not insert an FPC into the connector before soldering the connector. When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. Other Notes When coating the PC board after soldering the connector (to prevent the deterioration of insulation), perform the coating in such a way so that the coating does not get on the connector. The connectors are not meant to be used for switching. Terminal Paste solder PC board foot pattern 150 °C 180 °C 230 °C 220 °C 200 °C 260 °C Temperature Upper limit (Soldering heat resistance) Lower limit (Solder wettability) Preheating Peak temperature Time 25 sec. 70 sec. 60 to 120 sec. Please refer to the latest product specifications when designing your product. The soldered areas should not be subjected to force. |
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