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NFW31SP106X1E4L Datasheet(PDF) 1 Page - Murata Manufacturing Co., Ltd. |
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NFW31SP106X1E4L Datasheet(HTML) 1 Page - Murata Manufacturing Co., Ltd. |
1 / 2 page http://www.murata.com/ Data Sheet 1 o This data sheet is applied for LC Combined CHIP EMIFILr used for General Electronics equipment for your design. 2005.3.4 Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr LC Combined Type > Winding Type (1) : Input electrode (2) : Ground electrode (3) : Output electrode (1) (2) (3) 2.3 ±0.2 0.7 ±0.3 0.65 ±0.2 0.7 ±0.3 1.6 ±0.2 3.2 ±0.3 ∗No polarity. (in mm) 0 20 40 80 110 5 50 100 500 1000 2000 NFW31SP106X1E4 NFW31SP207X1E4 NFW31SP507X1E4 Frequency (MHz) NFW31SP506X1E4 60 NFW31SP206X1E4 NFW31SP157X1E4 NFW31SP107X1E4 NFW31SP307X1E4 NFW31SP407X1E4 (50 Ω - 50Ω) GND (2) (1) Input Output (3) No polarity. Chip EMIFILr LC Combined Type NFW31SP Series (1206 Size) I Dimension I IL of Main Items I Equivalent Circuit I Packaging Code Packaging Minimum Quantity L 180mm Plastic Tape 2000 K 330mm Plastic Tape 7500 I Rated Value (p: packaging code) Part Number Nominal Cut-off Freq. Insertion Loss (Cut-off Frequency) Attenuation at 500MHz Attenuation at 1000MHz Rated Current Rated Voltage Operating Temperature Range Number of Circuit NFW31SP106X1E4p 10MHz 6dB max. 30dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP206X1E4p 20MHz 6dB max. 30dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP506X1E4p 50MHz 6dB max. 30dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP107X1E4p 100MHz 6dB max. 20dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP157X1E4p 150MHz 6dB max. 30dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP207X1E4p 200MHz 6dB max. 10dBmin. 30dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP307X1E4p 300MHz 6dB max. 5dBmin. 15dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP407X1E4p 400MHz 6dB max. - 10dBmin. 200mA 25Vdc -40 °C to 85°C 1 NFW31SP507X1E4p 500MHz 6dB max. 6dBmax. 10dBmin. 200mA 25Vdc -40 °C to 85°C 1 !Caution (Rating) Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance . Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. I !Caution/Notice |
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