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CM322522-121KL Datasheet(PDF) 2 Page - Bourns Electronic Solutions |
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CM322522-121KL Datasheet(HTML) 2 Page - Bourns Electronic Solutions |
2 / 7 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors Packaging Specifications Packaging Reel Dimensions Model A B W F E P1 P2 P3 ¿D0 ¿D1 t1 t2 CM10 0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047) CM16 1.00 (.039) 1.80 (.071) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 0.60 (.024) 0.27 (.011) 1.20 (.047) CM20 1.45 (.057) 2.25 (.089) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.00 (.039) 0.25 (.010) 1.55 (.061) CM25 2.40 (.094) 2.90 (.114) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) 1.10 (.043) 0.25 (.010) 1.85 (.073) CM32 2.80 (.110) 3.60 (.142) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157) 2.00 (.079) 4.00 (.157) 1.50 (.059) — 0.25 (.010) 2.40 (.094) CM45 3.60 (.142) 4.90 (.193) 12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315) 2.00 (.079) 4.00 (.157) 1.50 (.059) — 0.30 (.012) 3.50 (.138) CM10, CM16, CM20, CM25, CM32 CM45 Model A B C D E W CM10 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM16 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM20 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM25 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM32 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 9 (.354) CM45 178 (7.008) 60 min. 13 (.512) 21 (.827) 2 (.079) 13 (.512) Model Quantity Weight CM10 10000 pcs 150 g CM16 3000 pcs 90 g CM20 3000 pcs 90 g Model Quantity Weight CM25 2000 pcs 100 g CM32 2000 pcs 190 g CM45 500 pcs 100 g Soldering Flow Soldering Infrared Soldering Vapor-phase Soldering Flow Soldering 260 °C maximum for 5 seconds (2 wave solder method) Infrared 200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds. If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow. Vapor-phase 215 °C for a maximum of 30 seconds. 10 seconds max. 260 °C Preheat: 100 to 150 °C 2 minutes min. Preheat: 100 to 150 °C 2 minutes min. 10 seconds max. 230 °C 200 °C 30 seconds max. Preheat: 100 to 150 °C 2 minutes min. 10 seconds max. 220 °C 215 °C 30 seconds max. B A W D C E P1 P2 P3 A D1 DIA. B ØDo W F E t2 t1 Tape running direction Chip Component P1 P2 P3 A B ØDo W F E t2 t1 Chip Component Tape running direction |
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