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A3P060-2PQ100Y Datasheet(PDF) 1 Page - Microsemi Corporation |
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A3P060-2PQ100Y Datasheet(HTML) 1 Page - Microsemi Corporation |
1 / 220 page January 2013 I © 2013 Microsemi Corporation ProASIC3 Flash Family FPGAs with Optional Soft ARM Support Features and Benefits High Capacity • 15 k to 1 M System Gates • Up to 144 kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution • Retains Programmed Design when Powered Off High Performance • 350 MHz System Performance • 3.3 V, 66 MHz 64-Bit PCI† In-System Programming (ISP) and Security • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)† • FlashLock® to Secure FPGA Contents Low Power • Core Voltage for Low Power • Support for 1.5 V-Only Systems • Low-Impedance Flash Switches High-Performance Routing Hierarchy • Segmented, Hierarchical Routing and Clock Structure Advanced I/O • 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above) • 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input • Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above) • I/O Registers on Input, Output, and Enable Paths • Hot-Swappable and Cold Sparing I/Os‡ • Programmable Output Slew Rate† and Drive Strength • Weak Pull-Up/-Down • IEEE 1149.1 (JTAG) Boundary Scan Test • Pin-Compatible Packages across the ProASIC3 Family Clock Conditioning Circuit (CCC) and PLL† • Six CCC Blocks, One with an Integrated PLL • Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback • Wide Input Frequency Range (1.5 MHz to 350 MHz) Embedded Memory† • 1 kbit of FlashROM User Nonvolatile Memory • SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)† • True Dual-Port SRAM (except ×18) ARM Processor Support in ProASIC3 FPGAs • M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug † A3P015 and A3P030 devices do not support this feature. ‡ Supported only by A3P015 and A3P030 devices. ProASIC3 Devices A3P0151 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000 Cortex-M1 Devices 2 M1A3P250 M1A3P400 M1A3P600 M1A3P1000 System Gates 15,000 30,000 60,000 125,000 250,000 400,000 600,000 1,000,000 Typical Equivalent Macrocells 128 256 512 1,024 2,048 – – – VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576 RAM Kbits (1,024 bits) – – 18 36 36 54 108 144 4,608-Bit Blocks –– 4 8 8 12 24 32 FlashROM Kbits 11 1 1 1 1 1 1 Secure (AES) ISP 3 – – Yes Yes Yes Yes Yes Yes Integrated PLL in CCCs –– 1 1 1 1 1 1 VersaNet Globals 4 6 6 18 18 18 18 18 18 I/O Banks 22 2 2 4 4 4 4 Maximum User I/Os 49 81 96 133 157 194 235 300 Package Pins QFN CS VQFP TQFP PQFP FBGA QN68 QN48, QN68, QN132 VQ100 QN132 CS121 VQ100 TQ144 FG144 QN132 VQ100 TQ144 PQ208 FG144 QN132 5 VQ100 PQ208 FG144/256 5 PQ208 FG144/256/ 484 PQ208 FG144/256/ 484 PQ208 FG144/256/ 484 Notes: 1. A3P015 is not recommended for new designs. 2. Refer to the Cortex-M1 product brief for more information. 3. AES is not available for Cortex-M1 ProASIC3 devices. 4. Six chip (main) and three quadrant global networks are available for A3P060 and above. 5. The M1A3P250 device does not support this package. 6. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs datasheet. Revision 13 |
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