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FH19C-15S-0.5SH05 Datasheet(PDF) 8 Page - Hirose Electric |
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FH19C-15S-0.5SH05 Datasheet(HTML) 8 Page - Hirose Electric |
8 / 9 page sRecommended Temperature Profile [For FH19C & FH19SC Series] HRS test condition Solder method :Reflow, IR/hot air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.’s Part Number:M705-221CM5-32-10.5) Test board :Glass epoxy 45mm∞100mm∞1.6mm thick Land dimensions :0.3mm∞0.8mm Metal mask :0.25mm∞0.8mm∞0.1mm This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult tour solder paste and equipment manufacturer for specific recommendations. MAX 250ç Start Time (Seconds) 25ç (60 sec.) (60 sec.) 90 sec. to 120 sec. Preheating Soldering 0 50 100 150 150ç 200ç 230ç 200 250 8 FH19C & FH19SC Seriesq0.5mm pitch, 0.9mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
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